Effects of Electroplating Parameters on the Composition and Morphology of Sn-Ag Solder, The

Journal of Electronic Materials,  Dec 2004  by Kim, J Y,  Yu, J,  Lee, J H,  Lee, T Y

• E-mail
• Print
• Link

7. T. Kondo et al., Plating Surface Finishing 51 (1998).

8. S. Arai, T. Watanabe, and M. Higashi, U.S. patent 5,902,472 (11 May 1999).

9. K. Oshima and S. Yuasa, U.S. patent 5,911,866 (15 June 1999).

10. S. Arai, U.S. patent 5,948,235 (7 September 1999).

11. I. Yanada and M. Tsujimoto, U.S. patent 6,099,713 (8 August 2000).

12. M.P. Toban, D.O. Marcktell, N.D. Brown, and O.A. Doyle, U.S. patent 6,210,556 (3 April 2001).

13. F.A. Lowenheim, Electroplating (New York: McGraw-Hill Book Co., 1978).

14. A.C. Tan, Tin and Solder Plating in the Semiconductor Industry (New York: Chapman & Hall, 1993).

15. S.H. Kirn, J.Y. Kim, J. Yu, and T.Y. Lee, J. Electron. Mater. 33, 948 (2004).

16. I. Ohno, J. Met. Finishing Jpn. 39, 149 (1988).

17. A. Brenner, Electrodeposition of Alloys, vol. I (New York: Academic Press, 1963).

18. G.G. Wan et al., Plating 559(1974).

J.Y. KIM,1 J. YU,1 J.H. LEE,2,4 and T.Y. LEE3

1.-Center for Electronic Packaging Materials, Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, Daejeon 305-701 Korea. 2.-Department of Materials Science and Engineering, Hongik University, Seoul 121-791 Korea. 3.-Department of Materials Engineering, Hanbat National University, Daejeon 305-719 Korea. 4.- E-mail: jhlee@wow.hongik.ac.kr

Copyright Minerals, Metals & Materials Society Dec 2004
Provided by ProQuest Information and Learning Company. All rights Reserved