AMCC, Tyco Electronics and Velio Communications Achieve Next-Generation Platform Integration by Demonstrating Interoperability of OIF Standard Interfaces at OFC 2003

Business Wire,  March 17, 2003  

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Business Editors/High-Tech Writers

OFC 2003

Booth #7620, Hall B

SAN DIEGO--(BUSINESS WIRE)--March 17, 2003

Applied Micro Circuits Corp. (Nasdaq:AMCC):

-- Best-in-class framers, backplane transceivers, backplanes and

STS-1 grooming switches form complete, standards-compliant OIF

interfaces, enabling the development of multi-service

provisioning platform system designs

Applied Micro Circuits Corp. (AMCC) (Nasdaq:AMCC), Tyco Electronics and Velio Communications Inc., today successfully demonstrated OIF interface interoperability of the companies' SONET/SDH products and the demonstration of a complete, end-to-end OC-48/OC-192/OC-768 SONET/SDH solution, which will be exhibited at the OIF_PLL Interoperability booth next week at OFC 2003 in Atlanta, OIF Booth #7620, Hall B.

For block diagram visit www.amcc.com/AMCC/Tyco/VelioInterop.

Via Tyco Electronics' QuadRoute Backplane, AMCC and Velio will showcase OIF SFI-4 and TFI-5 compliance using AMCC's MekongAC (S19223) 4xOC-48/OC-192 framer/pointer processor and Columbia 4x48 (S19207) 10Gig framer/mapper devices, and Velio's backplane SerDes (VC1022) and Zeus(TM) 180Gb/s SONET/SDH grooming switch (VC2002). Communication across the Tyco backplane and between the AMCC devices and the Zeus Grooming switch is accomplished with 2.5Gb/s, TFI-5 compliant serial links.

The OIF SPI-4-P2 interoperability demonstration will again utilize Velio's Zeus grooming switch and AMCC's Columbia 4x48 device working in conjunction with an FPGA device, which incorporates an off-the-shelf SPI-4-P2 embedded macro, and a logic analyzer with SPI-4-P2 support.

The SFI-5/OC-768 component of the OIF_PLL interoperability demonstration will involve AMCC's Pecos (S76804) OC-768 framer/pointer processor/Forward Error Correction (FEC)/digital wrapper device interfacing on its SFI-5 compliant interface to a 40G PBERT and a 40G optics module. Pecos's low-speed side will interface to the MekongAC, via AMCC's S2509 2.5G backplane SerDes device. Traffic generated from the 40G tester over Pecos's SFI-5 interface will be capable of traversing the Tyco backplane and the Zeus grooming switch, via the MekongAC and Velio 2.5G Backplane SerDes devices to demonstrate an end-to-end SFI-5 to SFI-4, to TFI-5 solution.

"By demonstrating interoperability with TFI-5, SFI-5, SFI-4, and SPI-4-P2 OIF interface standards, between all major components in the system, AMCC, Velio and Tyco Electronics provide customers with a real advantage -- a complete, standards-compliant solution from framers, to backplanes, to grooming switches," said John LoMedico, AMCC's vice president of marketing and applications, framer-layer products division.

"Standard interfaces give customers freedom and confidence in designing their system, but only as long as they can be assured that the individual components will interoperate. AMCC, Velio, and Tyco Electronics have demonstrated that this interoperability is a reality," said John D'Ambrosia, manager of semiconductor relations for Tyco Electronics.

"Demonstrating interoperability benefits our customers' time-to-market advantage, and allows AMCC, Velio and Tyco Electronics to offer their customers industry-leading, system-level solutions that adhere to standards," said Bill Woodruff, vice president of marketing at Velio.

OIF's PLL Interoperability Demonstration

The Optical Internetworking Forum (OIF) will sponsor the first Physical and Link Layer (PLL) Interoperability Demonstration at OFC 2003 in booth #7620, Hall B. This demonstration will highlight dynamic N-way interoperability of the SPI-4.2 Implementation Agreement (IA) as well as the SFI-4.1 IA, SFI-5 IA, the tunable laser IA and the TFI-5 work in-progress among OIF member companies. OIF is a rapidly growing non-profit organization with 250+ member companies to date, including many of the world's leading carriers, component and system vendors. The purpose of the OIF is to accelerate the deployment of interoperable, cost effective, and robust optical internetworks and their associated technologies. More information on the OIF and the interoperability demonstration can be found at www.oiforum.com.

About AMCC

AMCC designs, develops, manufactures and markets high-performance, high-bandwidth silicon solutions empowering intelligent optical networks. AMCC utilizes a combination of digital, mixed-signal and high-frequency analog design expertise coupled with system-level knowledge and multiple silicon process technologies to offer integrated circuit products that enable the transport of voice and data over fiber optic networks. The company's system solution portfolio includes switch fabric, traffic management, network processor, framer/mapper, PHY and PMD devices that address the high-performance needs of the evolving intelligent optical network. AMCC's corporate headquarters are located in San Diego. Sales and engineering offices are located throughout the world. For further information regarding AMCC, please visit our Web site at http://www.amcc.com.